退火温度对磁控溅射法制备的氧化铜薄膜导电类型的影响研究
首发时间:2026-04-15
摘要:本研究采用磁控溅射法制备了Li掺杂CuO薄膜,系统探究了退火温度对薄膜晶体结构、光学特性与电学性能的影响。在较低退火温度下(≤ 450 C),薄膜表现为n型导电,当退火温度较高(≥ 500 C)时,薄膜转变为p型导电。结果表明,空气气氛中500 C应是CuO材料中氧空位消失的临界温度,550 C是Cu空位浓度达到相对稳定状态的温度。总体而言,随着退火温度升高,薄膜载流子迁移率逐渐上升,光学吸收边发生蓝移,带隙变化与薄膜中主导导电缺陷的演变密切相关。即,氧空位为主时,禁带宽度较窄;Cu空位和Li掺杂缺陷为主时则禁带宽度较宽。本工作表明,在一定条件下可分别获得稳定的n型与p型CuO基材料,从而为构建CuO同质p-n结器件提供了可行性,使其在薄膜太阳能电池、近红外光探测器等领域具有潜在应用前景。
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Conduction type transition of magnetron-sputtered CuO thin films dependent on annealing temperature
Abstract:In this study, Li-doped CuO thin films were prepared via magnetron sputtering, and the effects of annealing temperature on the crystal structure, optical properties, and electrical properties of the films were systematically investigated. The films exhibited n-type conductivity at relatively low annealing temperatures (≤ 450 C) and transformed to p-type conductivity at higher annealing temperatures (≥ 500 C). The results indicate that 500 C in air atmosphere is the critical temperature for the elimination of oxygen vacancies in CuO, while 550 C is the temperature at which the Cu vacancy concentration reaches a relatively stable state. Overall, with increasing annealing temperature, the carrier mobility of the films increases gradually, and the optical absorption edge shows a blue shift. The band gap variation is closely related to the evolution of dominant conductive defects in the films. Specifically, the band gap is narrow when oxygen vacancies are dominant, whereas it becomes wider when Cu vacancies and Li-doping defects dominate. This work demonstrates that stable n-type and p-type CuO-based materials can be obtained separately under appropriate conditions, which provides feasibility for the construction of CuO homojunction p-n devices and shows potential application prospects in thin-film solar cells, near-infrared photodetectors, and other fields.In this paper
Keywords: Magnetron sputtering Li-doped CuO Film Electrical Properties Optical Properties
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退火温度对磁控溅射法制备的氧化铜薄膜导电类型的影响研究
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