基于微波退火技术制备的高性能短沟道金属源漏Ge pMOSFET
首发时间:2017-05-13
摘要:采用了微波退火技术制备得到了高性能的超浅NiGe/n-Ge肖特基结,并研究探讨了不同退火技术对肖特基结电学性能的影响。实验结果表明,微波退火可以有效抑制费米能级钉扎效应,从而有效降低NiGe/n-Ge肖特基结的空穴势垒(0.03 eV),进而减少肖特基结的结漏电。同时,由于微波技术具有低温退火的特性,利用微波退火技术可以制备得到结深很浅的NiGe/n-Ge肖特基结(24 nm),这能有效抑制器件小型化过程中出现的短沟道效应。进一步地,利用微波退火得到的高性能超浅NiGe/n-Ge肖特基结,我们制备获得了高开关比的短沟道金属源漏Ge pMOSFET,其开关比达到4个数量级。
关键词: 微电子 锗(Ge) 金属氧化物半导体场效应晶体管(MOSFET) 微波退火 金属源漏 短沟道
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High Performance Short-Channel-Length Ge pMOSFET with NiGe Souree/Drian Fabricated by Microwave Annealing
Abstract:The superior ultra-shallow NiGe/n-Ge Schottky junctions have been fabricated by a microwave annealing technique. The impacts of different annealing technology on the electrical properties of NiGe/n-Ge Schottky junctions were systematically investigated. It is found that microwave annealing could alleviates the interface defects induced Fermi level pinning effect significantly. Thus, the Schottky barrier height for hole have beendecreased to 0.03 eV. As a result, the junction leakage of the NiGe metal source/drain has been sufficiently reduced. In addition, since the microwave annealing technique has the low temperature budget, the junction depth of NiGe/n-Ge Schottky junction fabricated by microwave annealingwas ultra-shallow, ~24 nm. Furthermore,the high performance Schottky-barrier Ge p-channel metal-oxide-semiconductor field-effect transistors (pMOSFETs) have been revealed with the NiGe metal source/drain formed by microwave annealing, with an enhanced ON current and a high on/off ratio of four orders of magnitude.
Keywords: Microelectronics, Germanium, MOSFET, Microwave Annealing, Metal Source/Drain, Short Channel Length
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基于微波退火技术制备的高性能短沟道金属源漏Ge pMOSFET
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