Preparation of slurry for photocatalytic assisted chemical mechanical silicon

• 1、School of Mechanical Engineering, Shenyang University of Technology, Shenyang 110870

Abstract：Electronic components such as integrated circuit are wildly applied with the development of electronic information technology, and how to effectively obtain flat wafer is becoming the main research direction. To realize the overall wafer planarization, a new monocrystalline silicon polishing method assisted by photocatalysis is proposed to solve the problems shcu as slurry storage difficulty and environment pollution in the silicon chemico-mechanical polishing process and the slurry will be mainly discussed in this article. Firstly, the oxidation-reduction potential of the solution is revealed by the electrochemical method. Finally, the monocrystalline silicon is polished assisted by photocatalysis to validate the effectiveness. The results show that the oxidation-reduction potential is maximized by adding TiO2, H2O2, H3PO4 to the slurry and collaborating with UV. Compared by 7 test groups, the slurry consisted of TiO2, H2O2, H3PO4 and UV can realize the maximum material removal rate to the monocrystalline silicon, and the surface morphology is most suitable with the requirement after polishing.

Keywords： chemical mechanical polishing silicon photocatalysis titanium dioxide