基于S参数反演法的PCB材料介电特性仿真分析
首发时间:2011-02-04
摘要:为提高PCB上信号的传输质量,关键在于能够确定基板材料的电特性,控制信号线特征阻抗。随着电子产品的工作频率越来越高,作为搭载、连接IC等部件支撑体的PCB来讲,其性能直接影响了器件装配后系统的性能研究传输线的电学特性参数变得越来越重要。文中首先介绍了一些PCB传输线材料发展的知识和概念,借助于一些经典的传输线公式由S参数推到出PCB传输线(微带线,带状线)的介电常数和介质损耗角;然后文中利用一种先进的方法(HFSS高频仿真分析软件),对不同传输线进行了建模仿真,并对仿真结果进行了比较分析。最后通过仿真结果验证公式的正确性。
关键词: S参数 传输线介电常数(DK) 介质损耗角(DK) 特性阻抗
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The simulation and analysis of PCB dielectric properties based on S parameter inverse technique
Abstract:To improve the signal transmission quality in the PCB, the key is to determine the electrical characteristics of the substrate material, the control signal line characteristic impedance. With high frequency more and more electronic products, as the flight IC other components to connect the PCB support the body in terms of its performance directly affects the performance of the system after the device assembly of the electrical parameters of transmission lines is becoming increasingly important. This paper first describes some PCB transmission line materials, development of knowledge and concepts, by means of some classical formula from the S parameters of transmission line onto a PCB transmission line (microstrip, stripline) the dielectric constant and dielectric loss angle; then HFSS high frequency simulation software, carried out for different transmission line modeling and simulation, and simulation results were compared. Finally, simulation results verify the correctness of the formula.
Keywords: S parameters transmission line dielectric constant (DK) dielectric loss angle (DK) characteristic impedance
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